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Global Mixed-mode Technology Inc.
G2997
DDR Termination Regulator
Features
Support Both DDR I (1.25VTT) and DDR II (0.9 VTT) Requirements Input Voltage Range: 3.3V to 5.5V VLDOIN Voltage Range: 1.2V to 3.6V Requires Only 20F Ceramic Output Capacitance Supports High-Z in S3 and Soft-Off in S5 Integrated Divider Tracks 1/2 VDDQSNS for Both VTT and VTTREF Remote Sensing (VTTSNS) 20mV Accuracy for VTT and VTTREF 10mA Buffered Reference (VTTREF) Built-In Soft-Start Over Current Protection Thermal Shutdown Protection MSOP-10 and MSOP-10(Exposed Pad) Package
General Description
The G2997 is a 3A sink/source tracking termination regulator. It is specifically designed for low-cost/ low-external component count systems. The G2997 maintains a high speed operational amplifier that provides fast load transient response and only requires 20F (2x10F) of ceramic output capacitance. The G2997 supports remote sensing functions and all features required to power the DDR I / DDR II VTT bus termination according to the JEDEC specification. In addition, the G2997 includes integrated sleep-state controls placing VTT in High-Z in S3 (suspend to RAM) and soft-off for VTT and VTTREF in S5 (Shutdown). The G2997 is available in the thermally efficient 10pin MSOP and MSOP (Exposed PAD).
Applications
DDR I/II Memory Termination SSTL-2, SSTL-18 HSTL Termination
Ordering Information
ORDER NUMBER
G2997P7U G2997F6U
MARKING
G2997 G2997
TEMP. RANGE
-40C~85C -40C~85C
PACKAGE (Pb free)
MSOP-10 MSOP-10 (FD)
Note: P7: MSOP-10 F6: MSOP-10 (FD) U: Tape & Reel (FD): Thermal Pad
Pin Configuration
Typical Application Circuit
G2997
VDDQSNS VLDOIN VTT PGND VTTSNS 1 2 3 4 5 10 VIN 9 8 7 6 S5 GND S3 VTTREF 2.5V VDDQSNS VLDOIN VIN S5 GND S3 VTTREF C2 0.1F S3 VIN=5V S5
Thermal Pad
VTT C1 2*10F PGND VTTSNS
Top View MSOP-10
Bottom View
Note: Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
1
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(1)
G2997
Recommend Operating Range (1) (2)
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3.3V to 5.5V S3, S5 . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.1V to 5.5V VDDQSNS. . . . . . . .. . . . . . . . . . . . . . . . .1.6V to 3.6V VLDOIN . . . . . . . . . . . . . . . . . . . . . . . . . .1.2V to 3.6V PGND . . . . . . . . . . . . . . . . . . . . . .-0.1V to 0.1V Operating Ambient Temperature Range TA . . . . . . . . . . . . . . . . . . . . . . . .. . . . .-40C to 85C
Supply Voltage Range VIN, VLDOIN, VTTSNS, VDDQSNS, S3, S5..-0.3V to +6V PGND . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to 0.3V Output Voltage Range VTT, VTTREF . . . . . . . . . . . . . . . . . . . . . .-0.3V to 6V Maximum Junction Temperature,TJ . . . . .. . . ..160C Storage Temperature Range, TSTG.-55C to +160C Reflow Temperature (soldering, 10sec). . . . . 260C Thermal Resistance Junction to Ambient, (JA) MSOP-10 . . . . . . . . . . . . . . . . . . . . . . . . . . 120C/W MSOP-10 (FD) . . . . . . .. . . . . . . . . . . . . . . 60C/W(3)
Note: (1) All voltage values are with respect to the network ground terminal unless otherwise noted. (2) VLDOIN, VTTSNS, VDDQSNS, S3, S5 must be lower than VIN on operation.
(3)
Please refer to PCB size described in EV2997-10.
Electrical Characteristics
Specifications with standard typeface are for TA=25C, VIN=5V, VLDOIN=2.5V and VDDQSNS=2.5V. Unless otherwise specified. PARAMETER
Supply current, VIN Standby current, VIN Shutdown current, VIN Supply current, VLDOIN Standby current, VLDOIN Shutdown current, VLDOIN VDDQSNS input Impedance VTTSNS input current VTT output voltage VTT Output Voltage Load Regulation (VTTREF-VTT) VTT Source Current limit VTT Sink Current limit VTT leakage current in S3 mode VTT Discharge Current VTTREF output voltage VTTREF Voltage Load Regulation High Level Input Voltage Low Level Input Voltage Logic input leakage current Thermal Shutdown Thermal Shutdown Hystersis
SYMBOL
IVIN IVINSTB IVINSDN IVLDOIN
CONDITIONS
VVIN=5V, no load, S5=5V, S3 =5V VVIN=5V, no load, S5=5V, S3 =0V VVIN=5V, no load, S5=0V, S3 =0V
MIN
0.5 -----------------20 -30 -40 3 1.5 3 1.5 --10 ---20 1.6 ---1 -----
TYP
0.8 110 --0.03 0.1 0.1 200 0.3 1.25/0.9 ------4 2 4 2 0.01 20 1.25/0.9 --------160 20
MAX UNIT
2 200 1 2 10 1 --1 --20 30 40 --------------20 --1 1 ----mA A A mA A A K A V mV
VVIN=5V, no load, S5=5V, S3 =5V IVLDOINSTB VVIN=5V, no load, S5=5V, S3 =0V IVLDOINSDN VVIN=5V, no load, S5=0V, S3 =0V ZVDDQSNS VVIN=5V, S5=5V, S3 =5V
IVTTSNS
VTT VOSVTT
VVIN=5V, S5=5V, S3 =5V (DDR I/DDR II) IVTT=0 |IVTT|<1.5A |IVTT|<3A VTT=VDDQSNS/2 *0.95, PGOOD=Hi VTT=0 VTT=VDDQSNS/2 *1.05, PGOOD=Hi VTT=VVDDQSNS
IVTTOCLSRC IVTTOCLSNK
A A A mA V mV V V A C C
IVTTLK S3=0V, S5=5V IDISCHARGE S5=0V, VDDQSNS=0, VTT=0.5V VTTREF (DDR I/DDR II) VTTREF |IVTTREF|<10mA VIH S3 and S5 pin VIL S3 and S5 pin IILEAK S3 and S5 pin TSD
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
2
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
G2997
VIN Shutdown Current vs Temperature
CVLDOIN=10F/MLCC/X5R, CVIN=1F/MLCC/X5R, CVTTREF =0.1F,CVTT=20F/X5R/MLCC unless otherwise noted.
VIN Supply Current vs Temperature
1.1 1 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -40 -20 0 20 40 60 80 100 120 140 V IN =5.0V V DDQSNS=2.5V V LDOIN =2.5V VIN Shutdown Current (A) 0.9 VIN supply current (mA) 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 -40 -20 V IN =5.0V V DDQSNS=2.5V V LDOIN =2.5V 0 20 40 60 80 Temperature( C) 100 120 140
Temperature( C)
VLDOIN Supply Current vs Temperature
32 31 V LDOIN Supply Current ( A) 30 29 28 27 26 25 24 23 22 -40 -20 0 20 40 60 80 Temperature ( C) 100 120 140 V IN =5.0V V DDQSNS=2.5V V LDOIN =2.5V VLDOIN Shutdown Current (A)
VLDOIN Shutdown Current vs Temperature
0.6 0.5 0.4 0.3 0.2 0.1 0 -40 -20 V IN =5.0V V DDQSNS=2.5V V LDOIN =2.5V
0
20 40 60 80 Temperature ( C)
100 120 140
VTTREF Discharge Current vs Temperature
0.43
V TTREF Discharge Current (mA)
VTT Discharge Current vs Temperature
28 26
0.42 0.4 0.39 0.38 0.37 0.36 0.35 0.34 0.33 V IN =5.0V V DDQSNS=2.5V V LDOIN =2.5V 0 20 40 60 80 100 120 140 V TTREF =0.5V
VTT Discharge Current (mA)
0.41
24 22 20 18 16 V IN =5.0V V DDQSNS=2.5V V LDOIN =2.5V 0 20 40 60
V TT=0.5V
0.32 -40 -20
14 -40 -20
80
100 120 140
Temperature ( C)
Temperature ( C)
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
VTT Voltage Regulation vs VTT Load Current (DDR I )
1.27 1.265 VTT Volatge (V) 1.26 1.255 1.25 1.245 1.24 -3 -2 -1 0 1 2 3 V TT Load Current (A) V IN =5.0V V DDQSNS=2.5V VTT Volatge (V) V LDOIN =2.5V or 1.8V 0.918 0.912 0.906 0.9 0.894 0.888 0.882 0.876 -3 -2 V LDOIN =1.5V V LDOIN =1.2V V LDOIN =1.8V
G2997
VTT Voltage Regulation vs VTT Load Current (DDR II )
V IN =5.0V V DDQSNS=1.8V
-1 0 1 V TT Load Current (A)
2
3
VTTREF Voltage Load Regulation vs VTTREF Load Current (DDR I)
1.268 1.264 VTTREF Voltage (V) 1.26 1.256 1.252 1.248 1.244 1.24 1.236 -10 -8 V IN =5.0V V DDQSNS=2.5V V LDOIN =2.5V VTTREF Voltage (V) 0.918 0.914 0.91 0.906 0.902 0.898 0.894
VTTREF Voltage Load Regulation vs VTTREF Load Current (DDR II )
V IN =5.0V V DDQSNS=1.8V V LDOIN =1.8V
-6
-4
-2
0
2
4
6
8
10
0.89 -10 -8
-6
-4
-2
0
2
4
6
8
10
V TTREF Load Current (mA)
V TTREF Load Current (mA)
VDDQSNS Current vs Temperature
14 13.5
V DDQSNS Current (A)
VIN Supply Current vs VTT Load Current
1.2
V IN =5.0V V DDQSNS=2.5V V LDOIN =2.5V
V IN Supply Current (mA)
1.15 1.1 1.05 1 0.95 0.9 0.85 0.8
V IN =5.0V V DDQSNS=1.8V V LDOIN =1.8V
13 12.5 12 11.5 11 10.5 -40 -20
0
20
40
60
80
100 120 140
-2
-1.5
-1
Temperature ( C)
-0.5 0 0.5 1 V TT Load Current (A)
1.5
2
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
G2997
Start Up Waveforms S5 Low to High
Start Up Waveforms S5 Low to High
Start Up Waveforms S3 Low to High
Shutdown Waveforms S3 High to Low
Shutdown Waveforms S3 and S5 High to Low
VTTREF Voltage Transient Response
ILoad=10mA
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
VTT Voltage Load Transient Response
G2997
Recommended Minimum Footprint
MSOP-10 MSOP-10 (FD)
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Pin Description
PIN
1 2 3 4 5 6 7 8 9 10 Thermal Pad
G2997
NAME
DESCRIPTIONS
VDDQSNS VDDQ sense input VLDOIN Power supply for the VTT and VTTREF output stage VTT PGND VTTSNS VTTREF S3 GND S5 VIN Output voltage for connection to termination resistors, equal to VDDQSNS/2 Power ground output for the VTT output Voltage sense input for the VTT LDO. Connect to plus terminal of the output capacitor Buffered output that is a reference output ,equal to VDDQSNS/2 Active low suspend to RAM mode control pin, VTT is turned off and left Hi-Z Ground Active low shutdown control pin, both VTT and VTTREF are turned off and discharged to ground Analog input pin Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
Block Diagram
VIN
VDDQSNS
VLDOIN
VTTSNS S3 S5 SD/STB
VTT VTTREF
PGOOD
GND
PGND
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Description
VTT SINK/SOURCE REGULATOR The G2997 is a 3A sink/source tracking termination regulator designed specially for low-cost, low external components system where space is at premium such as notebook PC applications. The G2997 integrates high performance low-dropout linear regulator that is capable of sourcing and sinking current up to 3 A. This VTT linear regulator is implemented with ultimately fast response feedback loop so that small ceramic capacitors are enough to keep tracking to the VTTREF within 40mV at all conditions including fast load transient. To achieve tight regulation with minimum effect of trace resistance, a remote sensing terminal, VTTSNS, should be connected to the positive node of VTT output capacitor as a separate trace from the high current line from VTT. VTTREF REGULATOR The VTTREF block consists of an on-chip 1/2 divider, LPF and buffer. This regulator can source/sink current up to 10mA. Bypass VTTREF to GND using a 0.1F ceramic capacitor to ensure stable operation. To ensure better start-up and transient performance, the larger 1F ceramic capacitors are recommended. Power on sequence To operate safely, the G2997 must keep VIN voltage larger than other Input-PIN voltage .This condition is due to the internal parasitic diodes between VIN to others PIN for ESD issue. If the VIN voltage is lower than the other pins voltage, the G2997 will consume extra current through the parasitic diodes during the power-on period. Soft-Start The soft-start function of the VTT is achieved via a current clamp, allowing the output capacitors to be charged with low and constant current that gives linear ramp up of the output voltage. The current limit threshold is changed in two stages using an internal powergood signal. When VTT is outside the powergood threshold, the current limit level is 2A. When VTT rises above (VTTREF - 5%) or falls below (VTTREF + 5%) the current limit level switches to 4 A. The thresholds are typically VTTREF 5% (from outside regulation to inside) and 10% (when it falls outside). The soft-start function is completely symmetrical and it works not only from GND to VTTREF voltage, but also from VDDQSNS to VTTREF voltage. Note that the VTT output is in a high impedance state during the S3 state (S3 = low, S5 = high) and its voltage can be up to VDDQSNS voltage depending on the external condition. Note that VTT does not start under a full load condition.
G2997
S3, S5 Control and Soft-Off The S3 and S5 terminals should be connected to SLP_S3 and SLP_S5 signals respectively. Both VTTREF and VTT are turned on at normal state (S3 = high, S5 = high). VTTREF is kept alive while VTT is turned off and left high impedance in standby state (S3 = low, S5 = high). Both VTT and VTTREF outputs are turned off and discharged to the ground through internal MOSFETs during shutdown state (S5 = low). The control function is showed on the Table 1. Table 1. S3 and S5 Control Table STATE
Normal Standby Shutdown Shutdown
S3
Hi Lo Lo Hi
S5
Hi Hi Lo Lo
VTT
1.25V/0.9V 12mV/6mV (High-Z) 0V (Discharge) 0V (Discharge)
VREF
1.25V/0.9V 1.25V/0.9V 0V (Discharge) 0V (Discharge)
VTT Current Protection The LDO has a constant overcurrent limit (OCL) at 4A. This trip point is reduced to 2A before the outputvoltage comes within 5% of the target voltage or goes outside of 10% of the target voltage. Input Capacitor Adding a capacitance close to VLDOIN pin can improve the VTT performance when fast load- transient. In general, 1/2 COUT is recommended for the VLDOIN capacitance. Separating the VDDQSNS and VLDOIN pins will get better transient performance. The recommended capacitor types are tabulated in the Table 2. Output Capacitor For stable operation, total capacitance of the VTT output terminal can be equal or greater than 20F. The output capacitor should be located near VTT output terminal as close as possible to minimize the effect of ESR and ESL. The recommended capacitor types are tabulated in the Table 2. Table 2. CAP
C1 C2
MANUF
TAYO YUDEN TAYO YUDEN
PART NUMBER
EMK 325BJ106KD UMK 212BJ104KG
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Package Information
10 e A A
G2997
E1 b
E
C L
1 DETAIL "A"
2 e A2 b D A1 1 L 3 A GAUGE PLANE 0.25 R R1
0.076 C SEATING PLANE
SECTION A-A
MSOP-10 Package SYMBOL
A A1 A2 b b1 c c1 D E1 e E L 1 2 3 R R1 JEDEC
MIN.
----0.05 0.81 0.15 0.15 0.13 0.13 2.90 2.90
DIMENSION IN MM NOM.
--------0.86 ----0.20 ----0.15 3.00 3.00 0.50 BSC 4.90 BSC 0.55 ----12 REF 12 REF ---------
MAX.
1.10 0.15 0.91 0.30 0.25 0.23 0.18 3.10 3.10
MIN.
----0.002 0.032 0.006 0.006 0.005 0.005 0.114 0.114
DIMENSION IN INCH NOM.
--------0.034 ----0.008 0.006 0.118 0.118 0.020 BSC 0.193 BSC 0.0217 ----12 REF 12 REF ---------
MAX.
0.043 0.006 0.036 0.012 0.010 0.009 0.007 0.122 0.122
0.445 0
0.648 6
0.0175 0
0.0255 6
0.09 0.09
--------MO-187BA
0.004 0.004
---------
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
G2997
E2 E1 E
L D1 D
c 0.05 b
A2 A1
A
e
MSOP-10 (FD) Package
Note:1. JEDEC Outline: MO-187 BA/MO-187 BA-T (Thermally Enhanced Variations Only) 2. Dimension "D" does not include mold flash. Protrusions or gate burrs. Mold flash. Protrusions or gate burrs shall not exceed 0.15 per side. 3. Dimension "E1" does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25 per side. 4. Dimension "0.22" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the "0.22" dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum spac between protrusion and adjacent lead is 0.07mm. 5. Dimensions "D" and "E1" to be determined at datum plane.
SYMBOL
A A1 A2 b c D D1 E E1 E2 e L
MIN.
----0.00 0.75 0.17 0.08
DIMENSION IN MM NOM.
--------0.85 --------3.00 BSC 1.60 REF 4.90 BSC 3.00 BSC 1.715 REF 0.50 BSC 0.60 -----
MAX.
1.10 0.15 0.95 0.27 0.23
MIN.
----0.000 0.030 0.007 0.003
DIMENSION IN INCH NOM.
--------0.033 --------0.118 BSC 0.063 REF 0.193 BSC 0.118 BSC 0.068 REF 0.002 BSC 0.024 -----
MAX.
0.043 0.006 0.037 0.011 0.009
0.40 0
0.80 8
0.016 0
0.031 8
Taping Specification
PACKAGE
MSOP-10 MSOP-10 (FD)
Q'TY/BY REEL
2,500 ea 2,500 ea
F eed D irection T ypical M S O P P ackag e O rientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
Ver: 1.1 Jul 06, 2006
TEL: 886-3-5788833 http://www.gmt.com.tw
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